Off-Chip Coaxial to Microstrip Transition Using MEMs Trench

This paper will report the initial investigation into creating an off-chip coaxial launch for use in improving data throughput in System-on-Package applications. This type of launch will reduce the simultaneous switching noise (SSN) associated with getting high speed signals on and off of CMOS processing substrates using traditional packaging techniques. This launch will consist of a trench formed on the CMOS substrate that acts as a transition point for a miniature coaxial interconnect. The trench will be formed using MEMs processing techniques targeted at a Silicon substrate. The trench will be plated to make contact with the coaxial ground shield forming a low loss return path. This return path will considerably reduce SSN and enable much higher off-chip data rates. If successful, this new type of interconnect will decrease the bottleneck of transmitting large amounts of information off-chip and present a major breakthrough for System on Package performance.